Laser processing of ceramics is typically performed using a 10 6 or 9 3 micron co 2 laser with some ceramics also absorbing a.
Fiber laser ceramics.
Laser power at least 40 watts of co 2 laser power is recommended for glass and ceramic laser engraving and for glass marking as well as marking certain ceramic materials like zirconia.
Unlike water jet cutting laser cutting doesn t require extra consumables or disposables.
Ceramic cutting from spi lasers aluminium nitride aln has been developed into a commercially viable product with many useful mechanical properties.
The 1 06 micron wavelength of the fiber laser is recommended for laser marking certain ceramic materials like aluminum silicate.
The laser s focused localized energy achieves very narrow cuts with small kerf widths.
Cloudray ceramic parts dia 32mm 28 5mm for raytools fiber laser head.
However due to the cone shape of the focused ps laser.
Lasers also avoid placing mechanical stress on parts.
Since the diameter of the standard optical fiber is 125 μm the depth of the microchannel is designed as 250 μm to ensure that the al 2 o 3 slurry filled on top of the embedded optical fiber can be sintered by the co 2 laser and the embedded fiber can survive the laser sintering process.